Intel Centrino

By : http://en.wikipedia.org

Centrino

Components of the Centrino platform. From right, clockwise: Intel PRO/Wireless network adapter, Intel mobile processor, Intel mobile chipset (southbridge and northbridge).
Centrino, a platform-marketing initiative from Intel, covers a particular combination of CPU, mainboard chipset and wireless network interface in the design of a laptop personal computer. Intel claimed that systems equipped with these technologies should deliver better performance, longer battery life and broad wireless network interoperability. The chips were developed at Intel's Haifa, Israel R&D center and since their introduction in 2003, over US$5 billion worth have been sold.[citation needed]
To qualify for a Centrino label, laptop vendors must use all three Intel qualified parts, otherwise using only the processor and chipset will carry the Intel Core label instead.

Implementations
Carmel platform (2003)
Intel used Carmel as the code name for the first-generation Centrino platform introduced in March 2003.
The Carmel platform consists of:
an Intel Pentium M processor (code-named Banias or later Dothan) with a 400 MT/s FSB, Socket 478 and
an Intel 855 series chipset (code-named Odem or Montara with Intel Extreme Graphics 2), DDR-266 and
an Intel PRO/Wireless 2100 or later 2200 (IEEE 802.11b) mini-PCI Wi-Fi adapter (code-named Calexico or Calexico2).
Industry-watchers initially criticized the Carmel platform for its lack of an IEEE 802.11g-solution, because many independent Wi-Fi chip-makers like Broadcom and Atheros had already started shipping 802.11g products. Intel responded that the IEEE had not finalized the 802.11g standard at the time of Carmel's launch, and that it did not want to launch products not based on a finalized standard.
In early 2004, after the finalization of the 802.11g standard, Intel permitted an Intel PRO/Wireless 2200BG (code-named Calexico2) to substitute for the 2100. At the same time, they permitted the new Dothan Pentium M to substitute for the Banias Pentium M. Initially, Intel permitted only the 855GM chipset, which did not support external graphics. Later, Intel allowed the 855GME and 855PM chips, which did support external graphics, in Centrino notebooks.
Despite criticisms, the Carmel platform won quick acceptance among OEMs and consumers. Carmel could attain or exceed the performance of older Pentium 4-M platforms, while allowing for notebooks to operate for 4 to 5 hours on a 48 W-h battery. Carmel also allowed notebook-manufacturers to create thinner and lighter notebooks because its components did not dissipate much heat, and thus did not require large cooling systems.
Sonoma platform (2005)
Intel used Sonoma as the code name for the second-generation Centrino platform, introduced in January 2005.
The Sonoma platform consists of:
an Intel Pentium M processor (code-named Dothan) with a 533 MT/s FSB, Socket 479 and
an Intel Mobile 915 Express series chipset (code-named Alviso with Intel's GMA 900), DDR2-533 and
the Intel PRO/Wireless 2200 or 2915ABG mini-PCI Wi-Fi adapter (code-named Calexico2).
The Mobile 915 Express chipset, like its desktop version, supports many new features such as DDR2, PCI Express, Intel High Definition Audio, and SATA. Unfortunately, the introduction of PCI Express and faster Pentium M processors causes notebooks built around the Sonoma platform to have a shorter battery-life than their Carmel counterparts; Sonoma notebooks typically achieve between 3.5-4.5 hours of battery-life on a 53 W-h battery.
Napa platform (2006)
The code-name Napa designates the third-generation Centrino platform, introduced in January 2006 at the Winter Consumer Electronics Show. The platform initially supported Intel Core Duo processors but the newer Core 2 Duo processors were launched and supported in this platform from July 27th 2006 onwards.
The Napa platform consists of:
Processors - Socket M
an Intel Core Solo, Core Duo (code-named Yonah) processor, or
an Intel Core 2 Duo (code-named Merom) processor with a 667 MT/s FSB for Napa Refresh platform.
an Intel Mobile 945 Express-series chipset (code-named Calistoga with Intel's GMA 950), including ICH7M southbridge, and
RAM supported for DDR2-533 and DDR2-667 SODIMM.
the Intel PRO/Wireless 3945ABG mini-PCIe Wi-Fi adapter (code-named Golan), and
Some newer models (as of 1st quarter 2007) of the Napa Refresh platform contain the newer 4965AGN (a/b/g/draft-n) wireless cards.
Intel uses Centrino Duo branding for laptops with dual-core ("Core Duo") and ("Core 2 Duo") processors and retains the Centrino name for laptops with single core ("Core Solo") processors. Some of the initial Core Duo laptops, are still labeled as Intel Centrino rather than Centrino Duo.
[edit] Santa Rosa platform (2007)
The code-name Santa Rosa refers to the fourth-generation Centrino platform, which was released on Wednesday 9 May 2007.
The Santa Rosa platform consists of:
Processors - Socket P
an Intel Core 2 Duo (code-named Merom) second generation processor with 800 MT/s FSB, or
an Intel Core 2 Duo (code-named Penryn) 45nm processor scheduled for release in 1H 2008 [1] for Santa Rosa Refresh platform.
an Intel Mobile 965 Express chipset (code-named Crestline) with Intel's GMA X3100 graphics technology and ICH8M southbridge, 800 MT/s front side bus with Dynamic Front Side Bus Switching to save power during low utilization, and
Intel Dynamic Acceleration (IDA), better Windows Vista Aero support. [2]
RAM supported for DDR2-533 and DDR2-667 SODIMM.
EFI-compliant firmware, a successor to BIOS.
optional NAND flash-memory caching branded as Intel Turbo Memory (code-named Robson)
the Intel Wireless WiFi Link 4965AGN (a/b/g/draft-n) mini-PCIe Wi-Fi adapter (code-named Kedron).
Wireless-N technology boasts a 5X speed increase, along with a 2X greater coverage area, and supports 2.4 GHz and 5 GHz signal bands, with enough bandwidth for high definition audio and video streams. [1]
Santa Rosa platform come with dynamic acceleration technology. It allows single threaded applications to execute faster. When a single threaded application is running the CPU can turn off one of the CPU cores and overclock the active core. In this way the CPU maintains the same Thermal Profile as it would when both cores are active. Many expect Santa Rosa to perform well as a mobile gaming platform due to its ability to switch between single threaded and multithreaded tasks. Other power savings come from an Enhanced Sleep state where both the CPU cores and the chipset will power down.
The wireless chipset update was originally intended to include WWAN Internet access via HSDPA (3.5G), (code-named Windigo) co-developed with Nokia After announcing a working partnership, both later retracted the deal citing the lack of a clear business case for the technology.
Support for WiMAX (802.16) was originally scheduled for inclusion in Santa Rosa but appears to have been delayed until Montevina in 2008. There have, however, been reports that WiMax may still be introduced in 2007.
The Santa Rosa platform is branded as "Centrino Pro" when combined with the enhanced security technologies Intel introduced with vPro and will be called "Centrino Duo" when they are not used.
Montevina platform (2008)
The code-name Montevina refers to the fifth-generation Centrino platform, scheduled for release in Q2 2008. Montevina will support Penryn, Intel's 45nm die-shrink version of its current generation of 65nm Core 2 processors.
The code-named Penryn 45nm chip is planned to consume no more than 29W, compared to Merom's 34W TDP, the debut of SSE4.1, which will add 47 new instructions to SSSE3.
Montevina comprises the Cantiga chipset (with ICH9M southbridge) and with front side bus speed increase to 1067 MT/s front side bus. The graphics core is expected to be clocked at 475MHz which will contain ten unified shaders, up from the GMA 3000's eight.
Reports have suggested RAM support for DDR3-800 in preference to the less power-efficient DDR2-800 SODIMM.
NAND flash-memory caching branded as Intel Turbo Memory (code-named Robson 2).
LAN controller (code-named Boaz). Wireless Modules
the Intel Wireless WiFi Link mini-PCIe adapter (code-named Shiloh), and the add-on card WiMAX (802.16) (code-named Dana Point), or
the Intel combo WiFi/WiMAX Link mini-PCIe adapter (code-named Echo Peak).
Intel has reportedly invested US$300 million in Centrino advertising. Because of the ubiquity of the marketing campaign, many consumers mistakenly refer to Pentium M and Intel Core processors as "Centrinos". Many consumers have received the impression that only Centrino provides wireless connectivity in a notebook. This has resulted in increased demand for Intel's PRO/Wireless chipsets.
The Centrino marketing program has been widely assumed to be responsible for the success of Intel notebook PCs. However, findings of the Japanese FTC in March of 2005 indicate that the financial incentives associated with the Centrino program were used as illegal, anti-competitive practices by Intel to induce its customers not to buy notebook chips from Intel's long time rival AMD. In the quarter immediately following the JFTC ruling, AMD boasted more than 60 notebook computer design wins which was a strong resurgence from the drastic share reductions seen in 2003 and 2004.