Friday, August 15, 2008

Cloned Motherboards

by : http://www.hardwaresecrets.com/article/65/1

Cloned Motherboards

There are several motherboards that are not manufactured, rather they are bought from another manufacturer and have their tag sticked to them, as it happens to those from Amptron, Alton, Aristo and Matsonic. Matsonic used to sell their board under the brand "Eurone. All those "manufacturers" buy boards from ECS (EliteGroup Systems), which is one of the largest motherboard manufacturers in the world and is also the owner of the brand PCChips, one of the most popular motherboard manufacturer in developing countries because of their low prices.

ECS says they use the brand PCChips for their boards for the low-end PC market, while the boards sold under the brand ECS have better quality control. However, several ECS and PCChips motherboards are simply identical.

For example, if you buy an ECS K7SOM+ motherboard in the belief you are making a better deal than buying one from PCChips you are mistaken, for that motherboard is actually the M810DLU from PCChips. Similarly, if you an MS9138E from Matsonic you will be really taking home an M925 from PCChips.

We compiled two tables showing the correspondence of the most popular cloned motherboards on the market today. Notice that that table is far from being thorough, being just a fast guide to be used when buying a low cost motherboard.

Socket 478 (Intel Processors)

ECS

PCChips

Matsonic

Amptron

Chipset

P4IBASD V3.X

M902LU v3.0

MS9047C

Intel 845D

P4S5A

M930LMR

SiS 645

P4S5A/DX

M930ALU v5.x

SiS 645DX

P4S5MG/651+

M935ALU v5.1B

SiS 651

P4S5MG/GL

M935LU v5.1B (M935DELR)

SiS 650GL

P4S5MG/GL+

M935MLU5

SiS 650GL

P4S8AG

M947

SiS 648

P4VMM2

MS9138D

VIA P4M266

P4VMM2 v3.1

M925 ALMU (M925LU v3.x)

MS9138E

XP4-925ALU

VIA P4M266

P4VXAS2 v2.X

MS9107C

VIA P4X266A

P4VXASD2 v5.X

M922 v5.0

VIA P4X333

P4VXASD2+

M922LU v5.0

MS9147C

XP4-922LU

VIA P4X333

Socket A (AMD Processors)

ECS

PCChips

Matsonic

Amptron

Chipset

M825LU v3.x

K7-825LU v.3.1

VIA KM266

K7S7AG

M847

SiS 746

K7SEM v3.0

M810L v7.1C

K7-810CLM4

SiS 730S

K7SOM+

M810DLU

K7-810DLM4

SiS 730D

K7VMM

M825LMU

VIA KM266

K7VTA3 V2.X

MS8137C+

KT266A

K7VTA3 V7.0

MS8167C

KT333CF

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Monday, August 11, 2008

Athlon 64

by :www.hardwaresecrets.com/article/272

Athlon 64

In this tutorial we will list all Athlon 64, Athlon 64 FX and Athlon 64 X2 CPU models from AMD released to date and the main differences between them.
By the way, AMD has recently changed the name of those CPUs, dropping the number "64" from their name. So Athlon X2 and Athlon 64 X2 are the same CPU, and so on.
Those three CPUs are based on AMD64 architecture, where the main feature is the memory controller embedded in the processor itself and not located on the chipset like all other CPUs. Besides Athlon 64, Athlon 64 FX and Athlon 64 X2 we also have Sempron (models based on sockets 754 and AM2), Opteron and Turion 64 CPUs based on this architecture. Read our Inside AMD64 Architecture for an in-depth explanation on how these CPUs work.
Because of this architecture the communication between the CPU and the memory modules is done thru a dedicated memory bus, while the communication between the CPU and the chipset uses a separated bus, HyperTransport (click here to read our tutorial on HyperTransport).
AMD CPUs based on Athlon 64 architecture can be found with the following socket types:
Socket 754: Used by early Athlon 64, some Sempron models and Turion 64. Their memory controller is single channel, meaning that the CPU accesses memory at 64-bit rate.
Socket 939: Used by Athlon 64, Athlon 64 FX , Athlon 64 X2 and Opteron processors. Their memory controller is dual channel, meaning that the CPU accesses memory at 128-bit rate, if two memory modules are used.
Socket 940: Used by early Athlon 64 FX and Opteron processors. Their memory controller is dual channel, meaning that the CPU accesses memory at 128-bit rate, if two memory modules (or an even number of memory modules) are used. They require ECC memory type.
Socket AM2: Used by Athlon 64, Athlon 64 FX, Athlon 64 X2 and Sempron (some models) processors. On these models the embedded memory controller supports DDR2-533, DDR2-667 and DDR2-800 memories at dual channel configuration, meaning that the CPU accesses the memory at 128-bit rate if two modules (or an even number of memory modules) are used. Keep in mind that the memory controller of socket 754, 939 and 940 CPUs support only DDR memories.
Socket F: This 1,207-pin socket created for the latest Opteron models is also used by the Athlon 64 FX processors used on AMD’s Quad FX platform (Athlon 64 FX models 7x). CPUs based on this socket can operate under SMP (Symmetric Multiprocessing) mode, i.e. you can have more than one CPU working in parallel. Like socket AM2 processors, the memory controller found on socket F processors supports DDR2-533, DDR2-667 and DDR2-800 memories under dual channel configuration, meaning that the CPU can access the memory at a 128-bit rate if an even number of memory modules is used.
The memory controller integrated on socket AM2 and socket F CPUs can support DDR2-533, DDR2-667 and DDR2-800 memories. The problem, however, is how the memory bus clock is achieved. Instead of being generated thru the CPU base clock (HTT clock, which is of 200 MHz), it divides the CPU internal clock. The value of this divider is half the value of the CPU multiplier.
For example, an AMD64 CPU with a clock multiplier of 12x will have a memory bus divider of 6. So this CPU will work at 2.4 GHz (200 MHz x 12) and its memories will work at 400 MHz (DDR2-800, 2,400 MHz / 6). Keep in mind that DDR and DDR2 memories are rated with double their real clock rate.
The problem is when the CPU clock multiplier is an odd number. For an AM2 CPU with a clock multiplier of 13x, theoretically its memory bus divider would be of 6.5. Since the AMD64 memory bus doesn’t work with “broken” dividers, it is rounded up to the next higher number, seven in this case. So while this CPU will work at 2.6 GHz (200 MHz x 13), its memory bus will work at 371 MHz (742 MHz DDR) and not at 400 MHz (800 MHz DDR), making the CPU to not achieve the maximum bandwidth the DDR2 memory can provide.

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Installing Frontal USB Ports

By : www.hardwaresecrets.com/article/90

Installing Frontal USB Ports

The most sophisticated cases have frontal USB ports. To use them, you need to connect them to the motherboard of your computer. In this tutorial we will show how this connection must be done.






Figure 1: Detail of a case with two USB ports on its front (this case has also two jacks from on-board audio).
Nowadays motherboards have four, six or eight USB ports, but normally only two or four of them are directly soldered to the motherboard, at its back. Due to that, we generally two USB ports left in the motherboard. These left ports are usually available in 9- or 10-pin connector, as you can see on Figures 2 and 3. It is in that connector that the USB ports of the front panel of the case should be installed.






Figure 2: 9-pin USB header on the motherboard where the frontal USB ports should be installed.






Figure 3: Another example of the 9-pin USB header where the frontal USB ports should be installed. In this case, where we have two connectors available, just one will be used.






The biggest problem is that there is no standardization among the several motherboards manufacturers for the functions of each pin, that is, pin 1 of a motherboard connector may have a different meaning from pin 1 of a motherboard connector from another manufacturer. Because of that, each wire of the USB ports of the front panel of the case use individual connectors. As each USB port uses four wires, your case will have eight wires coming from the front panel, in case your case has two USB ports, which is the most common number.






Figure 4: Wires from the frontal USB ports of the case.
On each wire connector you can read its meaning, which may be +5V (or VCC or Power), D+, D - and GND. Besides the meaning, in each connector you can read whether the wire belongs to port 1 (or A or X) or to port 2 (or B or Y) of the case. The first step for the installation is to separate the wires according to the port, that is, to separate the wires in two groups: port 1 and port 2.


Next you must install the wires in the motherboard connector. The biggest problem is to know the meaning of each motherboard pin, since this is usually not written on the motherboard. For this task, you will need to check the board manual. There you will find the meaning of each connector pin, as we show on Figure 6. All you have to do is to install each of the wires (+5V, D+, D - and GND) in the correct places as shown in the manual. In the motherboard of our example, the port 1 wires must be connected the following way: +5V to pin 1, D- to pin 3, D+ to pin 5, and GND to pin 7. The port 2 wires must be connected the following way: +5V to pin 2, D- to pin 4, D+ to pin 6, and GND to pin 8. Notice that the meaning of each pin of your motherboard may be different from this example, therefore you will need to check your board manual. Usually the wires of a door will be one side of the connector (odd pins) and the wires of the other port will be on the other side (even pins).






Figure 6: USB header pin-out, from the motherboard manual.

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PC Assembling Problems

By :www.hardwaresecrets.com/article/42

Preventing Overheating

If you want to ensure that you won’t face overheating, random crashes (resets and the infamous “Blue Screen of Death”) and performance issues with your PC you should check whether it is assembled 100% correctly or not. In this tutorial we will show you where to look for assembling errors on your PC.
First, let’s start with the PC assembly itself. The errors describe on this page can overheat your PC thus causing random problems like random resets and crashes (PC “freezing”, “Blue Screen of Death”, etc).
Antistatic foam: Most motherboards come from factory with an antistatic foam (usually pink, white or black) in their packing. Many technicians, when installing the motherboard to the case, pinch this foam between motherboard and metallic chassis, thinking that this procedure will avoid that motherboard from touching the case metallic frame. It happens that this foam holds motherboard-generated heat, hindering the normal airflow that exists between motherboard and the case chassis. Therefore, it is quite common that a computer assembled using this foam crashes or issues random errors, due to the overheating.
Internal main power cord: In AT cases it is quite common to have the main power cord that connects the power supply to the power-on switch in front panel hanging loose over motherboard, often hindering the heat dissipation and even contacting the processor fan, causing it to stop running and PC to crash due to overheating. The ideal would be to lay this cable to the power supply switch by the right side of the case (facing front of case in upright position), in the upper part of the frame, and not hanging loose by left side, as it is common to find. Since AT cases are used only on very old PCs, you probably won’t face this issue, however we kept it listed here for historic purposes.

Other loose cables: The same idea applies to all other cables inside the PC, like the power supply cables and the flat cables used to connect the hard disk drives, optical drives and floppy disk drives. You should fasten these cables with a cable holder and put them inside an empty 5 ¼” bay in order to prevent these cables from blocking the airflow inside the PC and also preventing them to stuck the CPU fan.

Thermal grease: If you are facing overheating problems with your CPU, you should check whether thermal grease was correctly applied on the CPU or not.

Under dimensioned case: Cases look all the same, but they aren’t. Current Intel CPUs (Pentium 4 “Prescott” and beyond) require cases with a side duct in order to improve the airflow inside the case. If you don’t use a case with this side duct you may face overheating problems.

Extra fans wrongly installed: If your case has extra fans, you should check if they are installed on the right position, i.e. blowing the air in the right direction. Fans installed on the rear part of the case must be installed pulling the hot air from inside the PC case to the outside. Fans installed on the front part of the case must be installed pushing cold air from outside the case to the inside. Putting your hand near the fan should be enough for you to feel which way it is blowing air. If any extra fan is reversed, just remove it from your case and install it again, flipping it over.
The problems listed below are not directly related to overheating, but you should check them as well.
Loose motherboard: Your motherboard must be very well fastened to case's metallic frame. We've seen many cases where the computer gives random resets or crashes when the desk was rocked, just because the motherboard was practically loose inside the case. In other cases, it is very common for the PC to lose its machine setup when a new daughter board is installed, as motherboard bends (due to lack of padding points) and some of the motherboard soldering points contact the metallic frame. Therefore your motherboard must be very well fastened to case's frame, using the largest quantity of fastening points as possible.
Hard disk flat cable: If you still use a parallel IDE hard disk drive (e.g. ATA-100, ATA-133) instead of Serial ATA (SATA), you should check carefully how it is installed. Parallel IDE hard disk drives use a 40- or 80-wire flat cable that normally has three connectors, one in each cable end and one midway. The hard disk must be connected to one end of the cable and motherboard to the other end. The midway connector stays normally loose. It happens that some technicians connect the hard disk to the midway connector, is such a way that a cable end connector hangs loose. This is not good, as this stretch of the cable will actuate as an antenna, receiving and injecting noise in the data transmission, and as such hard disk transfer rate will be reduced. Also, if your hard disk cable is using a 40-wire flat cable, we recommend you to replace it with an 80-wire cable
Optical drive as hard disk slave: Also if you still use a parallel IDE hard disk drive, the optical drive (CD, DVD, etc) must be installed in the secondary IDE port of motherboard, configured as "master". Many people install the optical drive on the same cable as hard disk (using that midway connector that stays usually empty), as "slave". In that way the hard disk drive and the optical drive will have to strive for cable utilization, as they use same cable, and both devices can't change information with the system processor simultaneously, reducing computer performance. If your computer optical drive is sharing the same cable as the hard disk drive, undo this installation: install it on the motherboard secondary IDE port as “master” (you will need a 40- or 80-wire flat cable). Newer motherboards, however, are coming with just one parallel IDE port (see Figure 11), giving us no other option than installing the optical drive and the hard disk drive on the same cable. If this is your case, we highly recommend you to replace your hard disk drive with a Serial ATA one in order to leave the optical unit alone on the parallel IDE port, thus increasing system disk performance.

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Next Pentium 4





By: Dan Mepham


The next Pentium 4 processor, Prescott arrives



In 1965, just a few years after the first integrated circuits saw the light of day, a chemist by the name of Dr. Gordon Moore made an observation that would become a guiding rule for the next forty years. His prediction, affectionately dubbed 'Moore's Law' by the press, stated that the speed and number of transistors built into the latest integrated circuits would double every eighteen months. Three years later, in 1968, Moore would go on to co-found what is now the world’s largest semiconductor manufacturer, and would have a first-hand role in ensuring that his prediction would hold. And hold it has. Intel’s first processors in the early 1970’s consisted of just one or two thousand transistors. That increased to tens of thousands in the late seventies as Intel pushed its 8086 processor. Progress continued through the hundreds of thousands of transistors with the 80286 and 80386 families, and finally reached the million transistor mark with the 486DX and its integrated FPU. The nineties was the decade of the Pentium processor, from its 3-million transistor introduction in 1993 to the 25-million transistor Pentium III in the late nineties. Finally, the current Pentium 4 processors boast a modest 55-million transistor count. Key to increasing transistor count, and therefore performance, is the reduction of the size of those transistors. 55 million transistors as they were in 1970 would never have worked; the circuit would have been too huge and too hot to be practical. Decreasing the size of the transistors allows them to be made cheaper, switched faster, and run cooler. Over the decades we’ve seen transistors drop from several microns down to the current 0.13 micron technology.Today we see the introduction of Intel’s smallest mass-produced transistor at just 0.09 microns (90 nanometers). Welcome, ladies and gentlemen, to Prescott Country.
Caching In
The use of the 90nm transistor allows Intel to construct much larger (in terms of the number of transistors) processors, while keeping the physical size small. When processors are manufactured, the yield rates on those processors are directly related to how large, physically, the processors are. A processor that is twice the size of another is essentially twice as likely to contain manufacturing impurities, and therefore will be subject to much lower yield rates. We’ve seen this on a simple basis with respect to Intel’s server products. Later versions of the Pentium III Xeon, for example, incorporated huge on-die caches that bumped the transistor count into the hundreds of millions, and resulted in a die size two to three times the size of a typical desktop processor at the time. These huge Xeons were difficult to manufacture, and came with a corresponding price premium. The move to 90nm technology has allowed Intel to cram a comparatively huge amount of cache memory onto the Pentium 4 die. Prescott improves on the previous Northwood processor by boasting a huge 1MB L2 cache. Despite the larger cache, which helps to drive Prescott’s transistor count to over 125 million, the processor’s physical size remains manageable at only 112 square millimeters – roughly 50% smaller than Intel’s first Willamette Pentium 4 with its tiny 256kB L2 cache.In addition, Intel has also taken the opportunity to increase the size of the Pentium 4’s L1 cache as well. Prescott’s L1 data cache is now doubled to 16kB, while the L1 instruction cache (or Execution Trace Cache) remains at 12k micro-ops. The Pentium 4 was initially designed with a small 8kB L1 data cache as a tradeoff in order to maximize the speed of the cache. Set-associativity of the L1 data cache has also increased from 4-way to 8-way.








Figs. 1 & 2 - Color-enhanced photos of Intel's Pentium 4 processor dies. On the left is the 130nm Northwood core; the 90nm Prescott core is on the right. Notice the larger L2 area on the Prescott die.







As you'll see later in the benchmarks, however, there are tradeoffs necessary in order to implement such a large cache.







Branching Off
Intel has further made some subtle but important enhancements to the Pentium 4’s branch prediction systems. Mispredicted code branches result in pipeline stalls as the entire pipeline needs to be flushed to clear the bad branch. With the Pentium 4’s extremely deep pipeline (more on this later), stalls have a dramatic impact on performance.Despite the exemplary accuracy of the Pentium 4’s branch predictor units, there nevertheless exist situations in which the BPU simply cannot make a prediction. In this case, the Branch Target Buffer (BTB) contains no prediction information about the current branch, and so the processor defaults to a rather simple, static prediction algorithm. Intel has enhanced this simple static algorithm to be more accurate. Without excessive description, the new prediction algorithm examines the distance and other properties of the branch to attempt to ascertain whether the branch may be a loop-ending command, and thus whether or not it should be taken. Subtle enhancements have also been made to the dynamic brand prediction algorithms as well.Branch prediction success rate is often difficult to quantify, and changes to branch prediction schemes can show various outcomes, ranging from much better performance, to marginally better performance, or even to decreased performance in some situations. We have been given access to some in-house testing conducted by Intel, and while we cannot post actual numbers at this time, we can summarize the results as follows: Testing using the SPECint_base2000 software showed that Prescott’s mispredicted branch rate ranged from 54% lower to 10% higher than Northwood’s at the extremes, and the overall average branch misprediction rate was about 12% lower on the new Prescott core than Northwood; an impressive improvement.Again, these results are difficult to quantify in terms of real-world performance, but the effects should not be underestimated given the degree to which mispredicted branches impact the performance of Prescott’s deep pipeline.







Round 3, SSE Gets a Refresh
Prescott marks the introduction of Intel’s latest extensions to the IA-32 ISA, adding thirteen new instructions. Most of these new instructions make use of the Streaming SIMD Extension (SSE) registers, and as a result, Intel has named the new instructions SSE3. The majority of these instructions relate to graphics and complex arithmetic operations. Two of the instructions were designed to help software make better use of the processor’s Hyper-Threading capability by helping to indicate when a thread may no longer be engaged in useful work.Naturally the benefits of these added instructions will not become apparent until software developers begin to make use of them. As is generally the case with instruction set extensions, there will be particular pieces of software or particular operations that exhibit very tangible performance improvements, while others really have no use for the added instructions, and thus show no change.





Intel's 2004 Roadmap, Sock-et to Me!
Both Prescott and Northwood are introduced in 3.40 GHz versions today, and both are packaged in the current Socket-478 platform. 3.40 GHz will be the final stop for the Socket-478 platform at the high-end, however.When Intel introduces a 3.60 GHz variant of the Prescott processor in Q2 2004, it will be on the new Socket-775 platform only. Socket-775 boards will have much tougher power design specifications that will be necessary to feed these thirsty processors at 3.60 GHz and above. Subsequent versions of the Prescott processor, including the 3.80 GHz in Q3 2004, and the 4.00 GHz in Q4 2004, will appear on the Socket-775 platform only, as will Prescott’s successor, Tejas, in 2005. All Prescott Pentium 4 processors will operate with an 800 MHz FSB, and will feature Hyper-Threading Technology (excluding the 2.80A GHz model, which uses a 533 MHz bus and no Hyper-Threading).At the low-end, Intel will continue to use the Socket-478 platform for its Celeron processor through 2004. Over the year, the Celeron will slowly ramp up to 3.33 GHz using the 90nm process, and continue to use the Socket-478 platform. It will eventually migrate to the Socket-775 platform as well near the end of the year. All 90nm Celerons will get a bump to 256kB of L2 cache.









Fig. 3 - Intel's current 2004 roadmaps suggest the above processors will be introduced in the timeframes indicated. The last Socket-478 Pentium 4 processor is the 3.40 GHz parts introduced today.




As an aside, these 90nm Celerons may be of some interest to overclockers. A 2.53 GHz (533 MHz FSB) Celeron using the 90nm process will be introduced in Q2 2004, and depending on its price and the maturity of the process at that point, may prove to be a capable overclocker.
Incremental Improvements
Beyond the previously discussed items, Prescott also contains several incremental improvements versus the previous Northwood core. We won’t discuss these in great detail, but rather summarize them briefly below:
Automated functional block design & strained silicon technology
Shifter/Rotator block added to one of the core’s double-speed ALUs
More flexible trace cache
Added a dedicated integer multiplier, which results in lower integer multiply latency.
Increased micro-op scheduler capacity
Improved hardware and software prefetching capability
Additionally, to clear up any confusion that may be caused by the marketing, the following table summarizes current Intel Pentium 4 processors that are available as of today.
Fig. 4 - Intel's current desktop processor lineup. These processors are available at retail and OEM levels as of the time of publication of this article.

Something Rotten in Santa Clara
Despite what seems to be a largely improved processor, and one that should easily outperform a Northwood-core Pentium 4 at equivalent clock speed, this is not the case. Further, there are some strong indications that there is something very seriously wrong with Intel’s 90nm process. Firstly, Prescott was delayed. Earlier roadmaps showed Prescott arriving at the end of 2003, which clearly hasn't been the case. Secondly, Prescott’s pipeline has been deepened versus Northwood’s (probably related to the delays) from 20 stages up to a whopping 31 stages. More importantly, signs indicate that this wasn’t a previously planned change, and Intel seems much less inclined to discuss it than is typically the case when these types of changes are made. From a company that prides itself on adhering to its roadmaps religiously, and that typically talks about these changes openly, this is some rather alarming behavior. Typically a process shrink like this would allow an almost instant boost in clockspeed. The last drop, from the 180nm Willamette down to the 130nm Northwood allowed an almost instant 20% boost in clockspeed, which worked its way up to over 60% as the process was refined. The final Northwood at 3.40GHz is 70% faster than the fastest Willamette as a result of the success of the 130nm process.This time, on the other hand, the drop to 90nm seems not to be resulting in the usual improvements. So much so, in fact, that a rather last-minute change to the pipeline was necessary to produce decent yields at the promised speeds. The longer pipeline will lower Prescott’s IPC, and largely offset any gains as a result of the improvements discussed. See our benchmarks for direct comparison. Some would no doubt argue that Intel is simply taking its time, and preparing for the future, as there's no imminent danger from AMD at the moment (which also seems to be having trouble with its 130nm strained silicon process - coincidence?). There may be some validity to that argument. Unfortunately at this point we can’t offer anything more than speculation. Intel’s public position is that everything is just fine, a 31-stage pipeline was all part of the plan, and it still promises 4GHz by year end. Yet its actions seem to indicate behind-the-scenes scrambling. Usually when there's this much whispering about problems, and such a tight-lipped reaction from the company, there's at least some truth to the speculation. We leave you to form your own conclusions.
Benchmark Configuration
Intel Pentium 4 Processor 3.20E GHz (Prescott)
Intel Pentium 4 Processor 3.06 GHz (Northwood)
Intel Desktop Board D875PBZ, 875 Chipset
512 MB (2 x 256 MB) PC3200 DDR Memory in Dual-Channel Configuration
ATI Radeon 9700 Pro
Western Digital WD400BB 40 GB Hard Disk
Creative Labs SoundBlaster Live!
Enermax EG465P-VE 460W Power Supply
Microsoft Windows XP Professional w/ Service Pack 1
Microsoft DirexctX 9.0
Intel Chipset Drivers v/ 5.00.1012
Intel Application Accelerator v/ 3.5.0.2600
ATI Catalyst 4.1

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Socket T

By : http://en.wikipedia.org/wiki/Socket_T

Socket T
Specifications
Type:LGA

Chip form factors:Flip-chip land grid array

Contacts:775

Bus Protocol


FSB:533 MT/s, 800 MT/s, 1066 MT/s, 1333MT/s

Voltage range


Processors:
Intel Pentium 4 (2.66 - 3.80 GHz)Intel Celeron D (2.53 - 3.6 GHz )Intel Pentium 4 Extreme Edition (3.20 - 3.73 GHz)Intel Pentium D (2.66 - 3.60 GHz)Intel Pentium Extreme Edition (3.20 - 3.73 GHz)Intel Core 2 Duo (1.60 - 2.67 GHz)Intel Core 2 Extreme (2.66 - 2.93 GHz)Intel Core 2 Quad (2.4 GHz)Intel Xeon (1.86-2.66 GHz)

Socket T, also known as LGA775, is Intel's latest desktop CPU socket. LGA stands for Land Grid Array. The word "socket" is now a misnomer, because an LGA775 motherboard has no socket holes, instead it has 775 protruding pins which touch contact points on the underside of the processor (CPU).
The Prescott and Cedar Mill Pentium 4 cores, as well as the Smithfield and Presler Pentium D cores, currently use the LGA775 socket type. In July 2006, Intel released the desktop version of the Core 2 Duo (codenamed Conroe), which also uses this socket, as does the subsequent Core 2 Quad. Intel changed from Socket 478 to LGA775 because the new pin type offers better power distribution to the processor, allowing the front side bus to be raised to 1333 MT/s. The 'T' in Socket T was derived from the now cancelled Tejas core, which was to replace the Prescott core.
As it is now the motherboard which has the pins, rather than the CPU, the risk of pins being bent is transferred from the CPU to the motherboard. The risk of bent pins is reduced because the pins are spring-loaded and locate onto a surface, rather than into a hole. Also, the CPU is pressed into place by a "load plate", rather than human fingers directly. The installing technician lifts the hinged "load plate", inserts the processor, closes the load plate over the top of the processor, and pushes down a locking lever. The pressure of the locking lever on the load plate clamps the processor's 775 gold contact points firmly down onto the motherboard's 775 pins, ensuring a good connection. The load plate only covers the edges of the top surface of the CPU; the center is free to make contact with the cooling mechanism placed on top of the CPU.

Improvements in Heat Dissipation
The force from the load plate ensures that the processor is completely level, giving the CPU's upper surface optimal contact with the heat sink or cold-water block fixed onto the top of the CPU to carry away the heat generated by the CPU. This socket also introduces a new method of connecting the heat dissipation interface to the chip surface and motherboard. With Socket T, the heat dissipation interface is connected directly to the motherboard on four points, compared with the two connections of the Socket 370 and the "clamshell" four-point connection of the Socket 478. This was done to avoid the reputed danger of the heatsinks/fans of pre-built computers falling off in transit. LGA775 was announced to have better heat dissipation properties than the Socket 478 it was designed to replace; but the Prescott core CPUs (in their early incarnations) ran much hotter than the previous Northwood-core Pentium 4 CPUs, and this initially neutralized the benefits of better heat transfer. However, modern Core 2 Duo processors run at lower temperatures than the Prescott CPUs they replace.

Socket T mechanical load limits
All socket T processors(Pentium 4, Celeron, Core 2 and Quad Xeon) have the following mechanical maximum load limits which should not be exceeded during heatsink assembly, shipping conditions, or standard use. Load above those limits will crack the processor die and make it unusable.

The transition to the LGA packaging has lowered those load limits, which are smaller than the load limits of Socket 478 processors but they are bigger than socket 370 and socket A processors which were fragile. They are large enough to ensure that processors will not crack.

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Socket P

By : http://en.wikipedia.org/wiki/Socket_P

Socket P

Socket P
Specifications
Type:PGA

Chip form factors:Flip-chip pin grid array

Contacts:478

Bus Protocol

FSB:400MT/s, 533 MT/s, 667 MT/s, 800MT/s

Voltage range


Processors:
Intel Core Solo,Intel Core Duo,Intel Dual-Core Xeon (1.67, 2.0),Intel Core 2 Duo, (T5x00, T7x00),Intel Celeron M (Penryn, Merom)

The Intel Socket P is the mobile processor socket replacement for the new Intel Core 2 chips. It has an 800 MT/s FSB, that is switchable on the fly to 400MT/s to save power. It launched on May 9, 2007, as part of the Santa Rosa platform. Socket P has 478 pins, but is not pin-compatible with Socket M.

Processors
Celeron M 540
Core 2 Duo T7100
Core 2 Duo T7300
Core 2 Duo T7500
Core 2 Duo T7700
Rumored to use this socket:
Core 2 Duo X7800 (2.6 GHz)
Core 2 Duo X7900 (2.8 GHz)

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